74HC257PW,118 vs 74AHC157BQ feature comparison

74HC257PW,118 NXP Semiconductors

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74AHC157BQ NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP QFN
Package Description 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16 HVQCCN, LCC16,.1X.14,20
Pin Count 16 16
Manufacturer Package Code SOT403-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Family HC/UH AHC/VHC/H/U/V
JESD-30 Code R-PDSO-G16 R-PQCC-N16
JESD-609 Code e4 e4
Length 5 mm 3.5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.006 A 0.008 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP HVQCCN
Package Equivalence Code TSSOP16,.25 LCC16,.1X.14,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 33 ns 11 ns
Propagation Delay (tpd) 165 ns 21.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 4.4 mm 2.5 mm
Base Number Matches 1 3
Pbfree Code Yes

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