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74HC273BQ,115 vs HD74HC273RP feature comparison

74HC273BQ,115 NXP Semiconductors

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HD74HC273RP Renesas Electronics Corporation

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS RENESAS ELECTRONICS CORP
Part Package Code QFN SOIC
Package Description 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-764-1, DHVQFN-20 SOP, SOP20,.4
Pin Count 20 20
Manufacturer Package Code SOT764-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PQCC-N20 R-PDSO-G20
JESD-609 Code e4
Length 4.5 mm 12.8 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Propagation Delay (tpd) 225 ns 180 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 2.65 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 2.5 mm 7.5 mm
fmax-Min 24 MHz
Base Number Matches 1 4
Pbfree Code No
Samacsys Manufacturer Renesas Electronics
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 24000000 Hz
Max I(ol) 0.004 A
Package Equivalence Code SOP20,.4
Logic » FF/Latches
Logic » FF/Latches

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