74HC367DB,118 vs 74HC367PW,112 feature comparison

74HC367DB,118 Nexperia

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74HC367PW,112 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Part Package Code SSOP1 TSSOP
Package Description PLASTIC, SSOP-16 PLASTIC, TSSOP-16
Pin Count 16 16
Manufacturer Package Code SOT338-1 SOT403-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Nexperia
Additional Feature ONE FUNCTION WITH TWO BITS ONE FUNCTION WITH TWO BITS
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e4
Length 6.2 mm 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1 1
Number of Bits 6 6
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 29 ns 29 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 5.3 mm 4.4 mm
Base Number Matches 1 1
Factory Lead Time 4 Weeks
Control Type ENABLE LOW
Max I(ol) 0.006 A
Package Equivalence Code TSSOP16,.25
Packing Method TUBE
Prop. Delay@Nom-Sup 29 ns

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