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74HC3G04DP,125 vs 74LVC2G86GM feature comparison

74HC3G04DP,125 NXP Semiconductors

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74LVC2G86GM NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP QFN
Package Description 3 MM, PLASTIC, SOT505-2, TSSOP-8 1.60 X 1.60 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-255, SOT902-1, QFN-8
Pin Count 8 8
Manufacturer Package Code SOT505-2
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family HC/UH LVC/LCX/Z
JESD-30 Code S-PDSO-G8 S-PQCC-N8
JESD-609 Code e4
Length 3 mm 1.6 mm
Logic IC Type INVERTER XOR GATE
Max I(ol) 0.004 A 0.024 A
Moisture Sensitivity Level 1 1
Number of Functions 3 2
Number of Inputs 1 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP HVQCCN
Package Equivalence Code TSSOP8,.16 LCC8,.06SQ,20
Package Shape SQUARE SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 110 ns 12.4 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 1.65 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 3 mm 1.6 mm
Base Number Matches 1 4
Load Capacitance (CL) 50 pF
Prop. Delay@Nom-Sup 5.9 ns
Logic » Gates
Logic » Gates

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