74HC4050D vs TC74HC4050AFN-ELP feature comparison

74HC4050D Philips Semiconductors

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TC74HC4050AFN-ELP Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS TOSHIBA CORP
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.004 A
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Prop. Delay@Nom-Sup 26 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 4 1
Pbfree Code No
Part Package Code SOIC
Package Description SOP,
Pin Count 16
Additional Feature IOH = 6MA @ VOH = 4.13V; IOL = 6MA @ VOL = 0.33V; WITH EXTENDED INPUT VOLTAGE
Family HC/UH
Length 9.9 mm
Number of Functions 6
Number of Inputs 1
Peak Reflow Temperature (Cel) 240
Propagation Delay (tpd) 19 ns
Seated Height-Max 1.75 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm

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