74HC595BQ,115
vs
MC74HC595AMNTWG
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
|
Ihs Manufacturer |
NEXPERIA
|
|
Part Package Code |
QFN
|
|
Package Description |
2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-763-1, DHVQFN-16
|
|
Pin Count |
16
|
|
Manufacturer Package Code |
SOT763-1
|
|
Reach Compliance Code |
compliant
|
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Factory Lead Time |
6 Weeks
|
|
Samacsys Manufacturer |
Nexperia
|
|
Additional Feature |
SERIAL STANDARD OUTPUT FOR CASCADING
|
|
Count Direction |
RIGHT
|
|
Family |
HC/UH
|
|
JESD-30 Code |
R-PQCC-N16
|
|
JESD-609 Code |
e4
|
|
Length |
3.5 mm
|
|
Logic IC Type |
SERIAL IN PARALLEL OUT
|
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
8
|
|
Number of Functions |
1
|
|
Number of Terminals |
16
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Output Characteristics |
3-STATE
|
|
Output Polarity |
TRUE
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
HVQCCN
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
Packing Method |
TR, 7 INCH
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
240 ns
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1 mm
|
|
Supply Voltage-Max (Vsup) |
6 V
|
|
Supply Voltage-Min (Vsup) |
2 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
|
Terminal Form |
NO LEAD
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
QUAD
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Trigger Type |
POSITIVE EDGE
|
|
Width |
2.5 mm
|
|
fmax-Min |
24 MHz
|
|
Base Number Matches |
1
|
|
|
|
|
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