74HC74D,653
vs
CD74HC74M
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
GENERAL ELECTRIC SOLID STATE
|
| Part Package Code |
SOIC
|
|
| Package Description |
3.90 MM, PLASTIC, SOT-108-1, SO-14
|
|
| Pin Count |
14
|
|
| Manufacturer Package Code |
SOT108-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Family |
HC/UH
|
|
| JESD-30 Code |
R-PDSO-G14
|
|
| JESD-609 Code |
e4
|
|
| Length |
8.65 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
D FLIP-FLOP
|
|
| Max Frequency@Nom-Sup |
20000000 Hz
|
|
| Max I(ol) |
0.004 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
1
|
|
| Number of Functions |
2
|
|
| Number of Terminals |
14
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SOP
|
|
| Package Equivalence Code |
SOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
265 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trigger Type |
POSITIVE EDGE
|
|
| Width |
3.9 mm
|
|
| fmax-Min |
24 MHz
|
|
| Base Number Matches |
2
|
7
|
|
|
|
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