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74HC74PW,112 vs 74HC107NB feature comparison

74HC74PW,112 NXP Semiconductors

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74HC107NB NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP
Package Description 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14 DIP,
Pin Count 14
Manufacturer Package Code SOT402-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e4
Length 5 mm 19.025 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP J-K FLIP-FLOP
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Bits 1 2
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Equivalence Code TSSOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 265 ns 48 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 4.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE NEGATIVE EDGE
Width 4.4 mm 7.62 mm
fmax-Min 24 MHz 20 MHz
Base Number Matches 1 1
Logic » FF/Latches
Logic » FF/Latches

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