74HC74PW,118 vs MM74HC107J feature comparison

74HC74PW,118 NXP Semiconductors

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MM74HC107J National Semiconductor Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Part Package Code TSSOP
Pin Count 14
Manufacturer Package Code SOT402-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-GDIP-T14
JESD-609 Code e4 e0
Length 5 mm 19.43 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP J-K FLIP-FLOP
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Bits 1 2
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code TSSOP DIP
Package Equivalence Code TSSOP14,.25 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 265 ns 32 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE NEGATIVE EDGE
Width 4.4 mm 7.62 mm
fmax-Min 24 MHz 21 MHz
Base Number Matches 2 2
Package Description DIP, DIP14,.3

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