74HCT00D,653 vs M38510/65005BCX feature comparison

74HCT00D,653 NXP Semiconductors

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M38510/65005BCX Motorola Mobility LLC

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code SOIC DIP
Package Description SO-14 DIP,
Pin Count 14 14
Manufacturer Package Code SOT108-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 215.8 1630.6
CO2e (mg) 2675.92 20219.441
Family HCT HC/UH
JESD-30 Code R-PDSO-G14 R-GDIP-T14
JESD-609 Code e4
Length 8.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 29 ns
Propagation Delay (tpd) 29 ns 29 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm
Base Number Matches 2 5
Screening Level MIL-M-38510 Class B

Compare 74HCT00D,653 with alternatives

Compare M38510/65005BCX with alternatives