74HCT00D,653 NXP SemiconductorsBuy Now Datasheet |
MC74HC03AFR2 Rochester Electronics LLCBuy Now Datasheet |
Rohs Code | Yes | |
---|---|---|
Part Life Cycle Code | Transferred | Active |
Ihs Manufacturer | NXP SEMICONDUCTORS | ROCHESTER ELECTRONICS INC |
Part Package Code | SOIC | SOIC |
Package Description | SO-14 | SSOP, |
Pin Count | 14 | 14 |
Manufacturer Package Code | SOT108-1 | |
Reach Compliance Code | compliant | unknown |
HTS Code | 8542.39.00.01 | |
Family | HCT | HC/UH |
JESD-30 Code | R-PDSO-G14 | R-PDSO-G14 |
JESD-609 Code | e4 | |
Length | 8.65 mm | 6.2 mm |
Load Capacitance (CL) | 50 pF | |
Logic IC Type | NAND GATE | NAND GATE |
Max I(ol) | 0.004 A | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 4 | 4 |
Number of Inputs | 2 | 2 |
Number of Terminals | 14 | 14 |
Operating Temperature-Max | 125 °C | 125 °C |
Operating Temperature-Min | -40 °C | -55 °C |
Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package Code | SOP | SSOP |
Package Equivalence Code | SOP14,.25 | |
Package Shape | RECTANGULAR | RECTANGULAR |
Package Style | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH |
Packing Method | TR | |
Peak Reflow Temperature (Cel) | 260 | |
Prop. Delay@Nom-Sup | 29 ns | |
Propagation Delay (tpd) | 29 ns | 180 ns |
Qualification Status | Not Qualified | COMMERCIAL |
Schmitt Trigger | NO | |
Seated Height-Max | 1.75 mm | 2 mm |
Supply Voltage-Max (Vsup) | 5.5 V | 6 V |
Supply Voltage-Min (Vsup) | 4.5 V | 2 V |
Supply Voltage-Nom (Vsup) | 5 V | 3 V |
Surface Mount | YES | YES |
Technology | CMOS | CMOS |
Temperature Grade | AUTOMOTIVE | MILITARY |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
Terminal Form | GULL WING | GULL WING |
Terminal Pitch | 1.27 mm | 0.65 mm |
Terminal Position | DUAL | DUAL |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 3.9 mm | 5.3 mm |
Base Number Matches | 2 | 2 |
Output Characteristics | OPEN-DRAIN | |