74HCT00D-Q100 vs M74HCT00B1R feature comparison

74HCT00D-Q100 NXP Semiconductors

Buy Now Datasheet

M74HCT00B1R STMicroelectronics

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS STMICROELECTRONICS
Part Package Code SOIC DIP
Package Description 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 PLASTIC, DIP-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e4 e4
Length 8.65 mm 19.43 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 29 ns 29 ns
Screening Level AEC-Q100
Seated Height-Max 1.75 mm 5.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm 7.62 mm
Base Number Matches 2 1
Pbfree Code Yes
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Packing Method TUBE
Prop. Delay@Nom-Sup 29 ns
Qualification Status Not Qualified
Schmitt Trigger NO

Compare 74HCT00D-Q100 with alternatives

Compare M74HCT00B1R with alternatives