74HCT03D-Q100J vs 74HC03D-Q100J feature comparison

74HCT03D-Q100J NXP Semiconductors

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74HC03D-Q100J Nexperia

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Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code SOIC SOIC
Package Description 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 SOP,
Pin Count 14 14
Manufacturer Package Code SOT108-1 SOT108-1
Reach Compliance Code unknown compliant
Family HCT HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 8.65 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 36 ns 145 ns
Screening Level AEC-Q100 AEC-Q100
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 2 2
Factory Lead Time 6 Weeks
Date Of Intro 2017-02-01
Samacsys Manufacturer Nexperia
JESD-609 Code e4
Moisture Sensitivity Level 1
Packing Method TR, 13 INCH
Peak Reflow Temperature (Cel) 260
Terminal Finish NICKEL PALLADIUM GOLD SILVER
Time@Peak Reflow Temperature-Max (s) 30

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