74HCT123PW,112 vs 5962-8688601EA feature comparison

74HCT123PW,112 NXP Semiconductors

Buy Now Datasheet

5962-8688601EA Intersil Corporation

Buy Now
Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTERSIL CORP
Part Package Code TSSOP DIP
Package Description 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16 CERAMIC, DIP-16
Pin Count 16 16
Manufacturer Package Code SOT403-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature RETRIGGERABLE; TRIGGERABLE FROM CLEAR INPUT ALSO RETRIGGERABLE
Family HCT HC/UH
JESD-30 Code R-PDSO-G16 R-GDIP-T16
JESD-609 Code e4 e0
Length 5 mm
Load Capacitance (CL) 50 pF
Logic IC Type MONOSTABLE MULTIVIBRATOR MONOSTABLE MULTIVIBRATOR
Moisture Sensitivity Level 1
Number of Data/Clock Inputs 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code TSSOP DIP
Package Equivalence Code TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 77 ns 415 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm
Base Number Matches 2 10
Screening Level MIL-STD-883

Compare 74HCT123PW,112 with alternatives

Compare 5962-8688601EA with alternatives