74HCT132D-Q100
vs
74HCT132N,652
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
Package Description |
,
|
DIP, DIP14,.3
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2017-02-01
|
|
kg CO2e/kg |
12.4
|
12.4
|
Average Weight (mg) |
215.8
|
1630.6
|
CO2e (mg) |
2675.92
|
20219.441
|
JESD-609 Code |
e4
|
e4
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Moisture Sensitivity Level |
1
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Screening Level |
AEC-Q100
|
|
Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
DIP
|
Pin Count |
|
14
|
Manufacturer Package Code |
|
SOT27-1
|
Samacsys Manufacturer |
|
NXP
|
Family |
|
HCT
|
JESD-30 Code |
|
R-PDIP-T14
|
Length |
|
19.025 mm
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.004 A
|
Number of Functions |
|
4
|
Number of Inputs |
|
2
|
Number of Terminals |
|
14
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
DIP
|
Package Equivalence Code |
|
DIP14,.3
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Packing Method |
|
BULK
|
Prop. Delay@Nom-Sup |
|
41 ns
|
Propagation Delay (tpd) |
|
50 ns
|
Qualification Status |
|
Not Qualified
|
Schmitt Trigger |
|
YES
|
Seated Height-Max |
|
4.2 mm
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
NO
|
Technology |
|
CMOS
|
Temperature Grade |
|
AUTOMOTIVE
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Pitch |
|
2.54 mm
|
Terminal Position |
|
DUAL
|
Width |
|
7.62 mm
|
|
|
|
Compare 74HCT132D-Q100 with alternatives
Compare 74HCT132N,652 with alternatives