74HCT132D-Q100 vs CD74HCT132EX feature comparison

74HCT132D-Q100 NXP Semiconductors

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CD74HCT132EX Intersil Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTERSIL CORP
Part Package Code SOIC
Package Description SOP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 215.8 1630.6
CO2e (mg) 2675.92 20219.441
Samacsys Manufacturer NXP
Family HCT
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Length 8.65 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 50 ns
Screening Level AEC-Q100
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm
Base Number Matches 2 3
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 50 ns
Schmitt Trigger YES
Terminal Finish Tin/Lead (Sn/Pb)