74HCT132D-Q100 vs TC74HC132AP feature comparison

74HCT132D-Q100 NXP Semiconductors

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TC74HC132AP Toshiba America Electronic Components

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code SOIC DIP
Package Description SOP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 215.8 1630.6
CO2e (mg) 2675.92 20219.441
Samacsys Manufacturer NXP Toshiba
Family HCT HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Length 8.65 mm 19.25 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 50 ns 140 ns
Screening Level AEC-Q100
Seated Height-Max 1.75 mm 4.45 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm 7.62 mm
Base Number Matches 2 1
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 28 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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