74HCT132N,652 vs 74HC132PW-Q100,118 feature comparison

74HCT132N,652 NXP Semiconductors

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74HC132PW-Q100,118 NXP Semiconductors

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Source Content uid 74HCT132N,652 74HC132PW-Q100,118
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Part Package Code DIP TSSOP
Package Description DIP, DIP14,.3 TSSOP, TSSOP14,.25
Pin Count 14 14
Manufacturer Package Code SOT27-1 SOT402-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01
Family HCT HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e4
Length 19.025 mm 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP14,.3 TSSOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method BULK TAPE AND REEL
Peak Reflow Temperature (Cel) 260
Power Supplies 5 V 2/6 V
Prop. Delay@Nom-Sup 41 ns 38 ns
Propagation Delay (tpd) 50 ns 190 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 4.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm 4.4 mm
Base Number Matches 1 2
Moisture Sensitivity Level 1
Screening Level AEC-Q100

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