74HCT132N,652 vs 74HCT00D feature comparison

74HCT132N,652 NXP Semiconductors

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74HCT00D Toshiba America Electronic Components

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code DIP
Package Description DIP, DIP14,.3 SOIC-14
Pin Count 14
Manufacturer Package Code SOT27-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP Toshiba
Family HCT HCT
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e4
Length 19.025 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Packing Method BULK
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 41 ns 24 ns
Propagation Delay (tpd) 50 ns 24 ns
Qualification Status Not Qualified
Schmitt Trigger YES NO
Seated Height-Max 4.2 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 7.62 mm 3.9 mm
Base Number Matches 1 4
Factory Lead Time 53 Weeks, 1 Day
Date Of Intro 2016-05-24
Power Supply Current-Max (ICC) 50 mA

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