74HCT132N,652
vs
CD74HCT00E
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
GENERAL ELECTRIC SOLID STATE
Part Package Code
DIP
Package Description
SOT-27-1, DIP-14
DIP-14
Pin Count
14
Manufacturer Package Code
SOT27-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
NXP
Family
HCT
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
JESD-609 Code
e4
Length
19.025 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
0.004 A
Number of Functions
4
Number of Inputs
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
BULK
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
41 ns
30 ns
Propagation Delay (tpd)
50 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
YES
NO
Seated Height-Max
4.2 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
7.62 mm
Base Number Matches
1
7
Compare 74HCT132N,652 with alternatives
Compare CD74HCT00E with alternatives