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74HCT138D,653 vs HD74HCT138P feature comparison

74HCT138D,653 NXP Semiconductors

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HD74HCT138P Hitachi Ltd

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS HITACHI LTD
Part Package Code SOP DIP
Package Description 3.90 MM, PLASTIC, MS-012, SOT-109-1, SOP-16 DIP, DIP16,.3
Pin Count 16 16
Manufacturer Package Code SOT109-1
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 3 ENABLE INPUTS
Family HCT HCT
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e4
Length 9.9 mm 19.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER OTHER DECODER/DRIVER
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 53 ns 44 ns
Propagation Delay (tpd) 53 ns 44 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.06 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
Logic » Decoder/Drivers
Logic » Decoder/Drivers

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