74HCT139DB,112 vs SN74LS138MEL feature comparison

74HCT139DB,112 NXP Semiconductors

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SN74LS138MEL onsemi

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ONSEMI
Part Package Code SSOP1 SOIC
Package Description SOT-338-1, SSOP-16 EIAJ, SOP-16
Pin Count 16 16
Manufacturer Package Code SOT338-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family HCT LS
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e4
Length 6.2 mm 10.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type 2-LINE TO 4-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.004 A 0.008 A
Moisture Sensitivity Level 1 1
Number of Functions 2 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Equivalence Code SSOP16,.3 SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 51 ns 41 ns
Propagation Delay (tpd) 51 ns 41 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2.05 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS TTL
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm 5.275 mm
Base Number Matches 2 1
ECCN Code EAR99
Packing Method TR
Power Supply Current-Max (ICC) 10 mA

Compare 74HCT139DB,112 with alternatives

Compare SN74LS138MEL with alternatives