74HCT1G08GW,125 vs HD74HC1G08-EL feature comparison

74HCT1G08GW,125 NXP Semiconductors

Buy Now Datasheet

HD74HC1G08-EL Renesas Electronics Corporation

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer NXP SEMICONDUCTORS RENESAS ELECTRONICS CORP
Part Package Code TSSOP SOIC
Package Description PLASTIC, SC-88A, 5 PIN TSSOP,
Pin Count 5 5
Manufacturer Package Code SOT353-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HC/UH
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e6
Length 2 mm 2 mm
Load Capacitance (CL) 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.002 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 27 ns
Propagation Delay (tpd) 27 ns 125 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin (Sn) TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm 1.25 mm
Base Number Matches 2 2

Compare 74HCT1G08GW,125 with alternatives

Compare HD74HC1G08-EL with alternatives