74HCT238U vs CD74HC154MG4 feature comparison

74HCT238U NXP Semiconductors

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CD74HC154MG4 Texas Instruments

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Part Life Cycle Code Obsolete Lifetime Buy
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code WAFER SOIC
Package Description DIE, SOIC-24
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HC/UH
Input Conditioning STANDARD STANDARD
JESD-30 Code X-XUUC-N R-PDSO-G24
Logic IC Type 3-LINE TO 8-LINE DECODER 4-LINE TO 16-LINE DECODER
Number of Functions 1 1
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE INVERTED
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE SOP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Propagation Delay (tpd) 53 ns 265 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Pin Count 24
Samacsys Manufacturer Texas Instruments
Additional Feature 2 ENABLE INPUTS
JESD-609 Code e4
Length 15.4 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.0052 A
Moisture Sensitivity Level 1
Number of Bits 16
Number of Terminals 24
Package Equivalence Code SOP24,.4
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.16 mA
Prop. Delay@Nom-Sup 44 ns
Seated Height-Max 2.65 mm
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm

Compare 74HCT238U with alternatives

Compare CD74HC154MG4 with alternatives