74HCT238U
vs
SN74LS138MEL
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ONSEMI
|
| Part Package Code |
WAFER
|
SOIC
|
| Package Description |
DIE,
|
EIAJ, SOP-16
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HCT
|
LS
|
| Input Conditioning |
STANDARD
|
STANDARD
|
| JESD-30 Code |
X-XUUC-N
|
R-PDSO-G16
|
| Logic IC Type |
3-LINE TO 8-LINE DECODER
|
3-LINE TO 8-LINE DECODER
|
| Number of Functions |
1
|
1
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Polarity |
TRUE
|
INVERTED
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
SOP
|
| Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
SMALL OUTLINE
|
| Propagation Delay (tpd) |
53 ns
|
41 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
UPPER
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Pin Count |
|
16
|
| JESD-609 Code |
|
e4
|
| Length |
|
10.2 mm
|
| Max I(ol) |
|
0.008 A
|
| Moisture Sensitivity Level |
|
1
|
| Number of Terminals |
|
16
|
| Package Equivalence Code |
|
SOP16,.3
|
| Packing Method |
|
TR
|
| Power Supply Current-Max (ICC) |
|
10 mA
|
| Prop. Delay@Nom-Sup |
|
41 ns
|
| Seated Height-Max |
|
2.05 mm
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
5.275 mm
|
|
|
|
Compare 74HCT238U with alternatives
Compare SN74LS138MEL with alternatives