74HCT251DB,118 vs SN74LS604N feature comparison

74HCT251DB,118 NXP Semiconductors

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SN74LS604N Freescale Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code SSOP1
Package Description SOT-338-1, SSOP-16 DIP, DIP28,.6
Pin Count 16
Manufacturer Package Code SOT338-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Family HCT
JESD-30 Code R-PDSO-G16 R-PDIP-T28
JESD-609 Code e4 e0
Length 6.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER D FLIP-FLOP
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 1 8
Number of Inputs 8
Number of Outputs 1
Number of Terminals 16 28
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP DIP
Package Equivalence Code SSOP16,.3 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 53 ns
Propagation Delay (tpd) 66 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES NO
Technology CMOS TTL
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm
Base Number Matches 2 4
Trigger Type POSITIVE EDGE

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