74HCT273D vs TC74HCT273AFW-TP1 feature comparison

74HCT273D Microchip Technology Inc

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TC74HCT273AFW-TP1 Toshiba America Electronic Components

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Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC TOSHIBA CORP
Package Description DIP-20 SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-XDIP-T20 R-PDSO-G20
JESD-609 Code e0
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Functions 8 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Base Number Matches 5 1
Pbfree Code No
Part Package Code SOIC
Pin Count 20
Length 12.8 mm
Load Capacitance (CL) 50 pF
Number of Bits 8
Peak Reflow Temperature (Cel) 240
Propagation Delay (tpd) 38 ns
Seated Height-Max 2.7 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.5 mm
fmax-Min 24 MHz

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