74HCT377DB,112 vs GD74HCT377J feature comparison

74HCT377DB,112 NXP Semiconductors

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GD74HCT377J LG Semicon Co Ltd

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS LG SEMICON CO LTD
Part Package Code SSOP2
Package Description PLASTIC, SSOP-20 DIP, DIP20,.3
Pin Count 20
Manufacturer Package Code SOT339-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature WITH HOLD MODE
Family HCT
JESD-30 Code R-PDSO-G20 R-XDIP-T20
JESD-609 Code e4 e0
Length 7.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 18000000 Hz 22000000 Hz
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1
Number of Bits 8
Number of Functions 1 8
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code SSOP DIP
Package Equivalence Code SSOP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 48 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.3 mm
fmax-Min 60 MHz
Base Number Matches 2 2

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