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74HCT377NB vs 74HCT377PW,118 feature comparison

74HCT377NB NXP Semiconductors

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74HCT377PW,118 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description DIP, PLASTIC, TSSOP-20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH HOLD MODE WITH HOLD MODE
Family HCT HCT
JESD-30 Code R-PDIP-T20 R-PDSO-G20
Length 26.73 mm 6.5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 48 ns 48 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 4.4 mm
fmax-Min 18 MHz 60 MHz
Base Number Matches 1 1
Rohs Code Yes
Part Package Code TSSOP2
Pin Count 20
Manufacturer Package Code SOT360-1
Factory Lead Time 4 Weeks
JESD-609 Code e4
Max Frequency@Nom-Sup 18000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP20,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30
Logic » FF/Latches
Logic » FF/Latches

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Compare 74HCT377PW,118 with alternatives