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74HCT377U vs 74HCT377DB,118 feature comparison

74HCT377U NXP Semiconductors

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74HCT377DB,118 NXP Semiconductors

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Source Content uid 74HCT377U 74HCT377DB,118
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code DIE SSOP2
Package Description DIE, PLASTIC, SSOP-20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-XUUC-N R-PDSO-G20
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 48 ns 48 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 18 MHz 60 MHz
Base Number Matches 2 2
Pin Count 20
Manufacturer Package Code SOT339-1
Factory Lead Time 4 Weeks
Additional Feature WITH HOLD MODE
JESD-609 Code e4
Length 7.2 mm
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 18000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Terminals 20
Package Equivalence Code SSOP20,.3
Packing Method TR
Seated Height-Max 2 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 0.65 mm
Width 5.3 mm
Logic » FF/Latches
Logic » FF/Latches

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