74HCT377U vs CD74HCT377EX feature comparison

74HCT377U NXP Semiconductors

Buy Now Datasheet

CD74HCT377EX Intersil Corporation

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTERSIL CORP
Part Package Code DIE
Package Description DIE, DIP-20
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT
JESD-30 Code R-XUUC-N R-PDIP-T20
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8
Number of Functions 1 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 48 ns
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 18 MHz
Base Number Matches 2 4
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 16000000 Hz
Max I(ol) 0.004 A
Number of Terminals 20
Package Equivalence Code DIP20,.3
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

Compare 74HCT377U with alternatives