74HCT4514PW,118 vs CD4514BE feature comparison

74HCT4514PW,118 NXP Semiconductors

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CD4514BE Intersil Corporation

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTERSIL CORP
Part Package Code TSSOP2
Package Description SOT-355, 24 PIN DIP-24
Pin Count 24
Manufacturer Package Code SOT355-1
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature ADDRESS LATCHES
Family HCT 4000/14000/40000
Input Conditioning LATCHED LATCHED
JESD-30 Code R-PDSO-G24 R-PDIP-T24
JESD-609 Code e4 e0
Length 7.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OTHER DECODER/DRIVER 4-LINE TO 16-LINE DECODER
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 24 24
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 83 ns 970 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 18 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4.4 mm
Base Number Matches 2 7
ECCN Code EAR99
Max I(ol) 0.00041999999999999996 A
Package Equivalence Code DIP24,.6
Prop. Delay@Nom-Sup 970 ns

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