74HCT4514PW,118 vs TC74AC138F(TP1) feature comparison

74HCT4514PW,118 NXP Semiconductors

Buy Now Datasheet

TC74AC138F(TP1) Toshiba America Electronic Components

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code TSSOP2 SOIC
Package Description SOT-355, 24 PIN SOP,
Pin Count 24 16
Manufacturer Package Code SOT355-1
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature ADDRESS LATCHES 3 ENABLE INPUTS
Family HCT AC
Input Conditioning LATCHED STANDARD
JESD-30 Code R-PDSO-G24 R-PDSO-G16
JESD-609 Code e4 e0
Length 7.8 mm 10.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OTHER DECODER/DRIVER 3-LINE TO 8-LINE DECODER
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 24 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 83 ns 10.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.9 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4.4 mm 5.3 mm
Base Number Matches 2 1
Pbfree Code No
ECCN Code EAR99

Compare 74HCT4514PW,118 with alternatives

Compare TC74AC138F(TP1) with alternatives