74LCX257MTC
vs
74LVC157AD-T
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
End Of Life
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
NEXPERIA
|
| Package Description |
TSSOP, TSSOP16,.25
|
,
|
| Manufacturer Package Code |
948AH
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Family |
LVC/LCX/Z
|
|
| JESD-30 Code |
R-PDSO-G16
|
|
| JESD-609 Code |
e4
|
e4
|
| Length |
5 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.024 A
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
4
|
|
| Number of Inputs |
2
|
|
| Number of Outputs |
1
|
|
| Number of Terminals |
16
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
3-STATE
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Prop. Delay@Nom-Sup |
6 ns
|
|
| Propagation Delay (tpd) |
7.2 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4.4 mm
|
|
| Base Number Matches |
4
|
3
|
| Rohs Code |
|
Yes
|
| Date Of Intro |
|
2017-02-01
|
|
|
|
Compare 74LVC157AD-T with alternatives