74LCXH162244MTX
vs
74ALVCH162244DGG,1
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Package Description |
6.10 MM, MO-153ED, TSSOP-48
|
PLASTIC, TSSOP2-48
|
| Pin Count |
48
|
48
|
| Manufacturer Package Code |
48 LD,TSSOP,JEDEC MO-153, 6.1MM WIDE
|
SOT362-1
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Control Type |
ENABLE LOW
|
|
| Family |
LVC/LCX/Z
|
|
| JESD-30 Code |
R-PDSO-G48
|
|
| JESD-609 Code |
e4
|
|
| Length |
12.5 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
BUS DRIVER
|
|
| Max I(ol) |
0.012 A
|
|
| Moisture Sensitivity Level |
2
|
|
| Number of Bits |
4
|
|
| Number of Functions |
4
|
|
| Number of Ports |
2
|
|
| Number of Terminals |
48
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
3-STATE WITH SERIES RESISTOR
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP48,.3,20
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
5.3 ns
|
|
| Propagation Delay (tpd) |
6.4 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
6.1 mm
|
|
| Base Number Matches |
2
|
2
|
|
|
|
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