74LS157F vs 54LS157DMQB feature comparison

74LS157F NXP Semiconductors

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54LS157DMQB Rochester Electronics LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP ROCHESTER ELECTRONICS LLC
Package Description , CERAMIC, DIP-16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Load Capacitance (CL) 15 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 27 ns 23 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 4
Part Package Code DIP
Pin Count 16
Length 19.43 mm
Screening Level MIL-STD-883 Class B
Seated Height-Max 5.08 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

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