74LS175N vs CD54HC174F3A feature comparison

74LS175N NXP Semiconductors

Buy Now Datasheet

CD54HC174F3A Texas Instruments

Buy Now Datasheet
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SIGNETICS CORP TEXAS INSTRUMENTS INC
Part Package Code DIP DIP
Package Description DIP, DIP-16
Pin Count 16 16
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LS HC/UH
JESD-30 Code R-PDIP-T16 R-GDIP-T16
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 4 6
Number of Functions 1 6
Number of Terminals 16 16
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 25 ns 250 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 6 V
Supply Voltage-Min (Vsup) 4.75 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO NO
Technology TTL CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 30 MHz 23 MHz
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code No
ECCN Code EAR99
Samacsys Manufacturer Texas Instruments
Additional Feature DUMMY VAL
JESD-609 Code e0
Length 19.56 mm
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.0052 A
Package Equivalence Code DIP16,.3
Packing Method TUBE
Power Supply Current-Max (ICC) 0.16 mA
Prop. Delay@Nom-Sup 50 ns
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare 74LS175N with alternatives

Compare CD54HC174F3A with alternatives