74LS175N vs SN74HCT273DWE4 feature comparison

74LS175N NXP Semiconductors

Buy Now Datasheet

SN74HCT273DWE4 Texas Instruments

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP TEXAS INSTRUMENTS INC
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP20,.4
Pin Count 16 20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.31.00.01
Family LS HCT
JESD-30 Code R-PDIP-T16 R-PDSO-G20
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 4 8
Number of Functions 1 1
Number of Terminals 16 20
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 25 ns 42 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 30 MHz 23 MHz
Base Number Matches 2 1
Rohs Code No
ECCN Code EAR99
Samacsys Manufacturer Texas Instruments
JESD-609 Code e4
Length 12.8 mm
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP20,.4
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.08 mA
Seated Height-Max 2.65 mm
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm

Compare 74LS175N with alternatives

Compare SN74HCT273DWE4 with alternatives