74LS175N vs MC54HC112JD feature comparison

74LS175N Philips Semiconductors

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MC54HC112JD Motorola Mobility LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP MOTOROLA INC
Package Description DIP, DIP, DIP16,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS HC/UH
JESD-30 Code R-PDIP-T16 R-GDIP-T16
Logic IC Type D FLIP-FLOP J-K FLIP-FLOP
Number of Bits 4 2
Number of Functions 1 2
Number of Terminals 16 16
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 25 ns 38 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 6 V
Supply Voltage-Min (Vsup) 4.75 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE NEGATIVE EDGE
fmax-Min 30 MHz 20 MHz
Base Number Matches 3 1
Rohs Code No
JESD-609 Code e0
Length 19.3 mm
Load Capacitance (CL) 50 pF
Package Equivalence Code DIP16,.3
Seated Height-Max 4.19 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

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