74LS375N
vs
N74LS375N
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SIGNETICS CORP
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP,
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
LS
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
Logic IC Type
D LATCH
D LATCH
Number of Bits
2
4
Number of Functions
2
1
Number of Terminals
16
16
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
25 ns
27 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Trigger Type
HIGH LEVEL
LOW LEVEL
Base Number Matches
2
1
JESD-609 Code
e0
Length
19.09 mm
Max I(ol)
0.008 A
Package Equivalence Code
DIP16,.3
Power Supply Current-Max (ICC)
12 mA
Prop. Delay@Nom-Sup
30 ns
Seated Height-Max
4.06 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare 74LS375N with alternatives
Compare N74LS375N with alternatives