74LS375N vs TC74HC259P feature comparison

74LS375N NXP Semiconductors

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TC74HC259P Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP TOSHIBA CORP
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS HC/UH
JESD-30 Code R-PDIP-T16 R-PDIP-T16
Logic IC Type D LATCH D LATCH
Number of Bits 2 1
Number of Functions 2 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 25 ns 205 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 6 V
Supply Voltage-Min (Vsup) 4.75 V 2 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology TTL CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type HIGH LEVEL LOW LEVEL
Base Number Matches 2 1
Rohs Code No
Additional Feature 1:8 DMUX FOLLOWED BY LATCH
JESD-609 Code e0
Length 19.43 mm
Seated Height-Max 5 mm
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Width 7.62 mm

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