74LVC138APW-T vs GD74HCT137D feature comparison

74LVC138APW-T NXP Semiconductors

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GD74HCT137D Goldstar Electron Co Ltd

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS GOLDSTAR ELECTRON CO LTD
Part Package Code TSSOP
Package Description TSSOP, TSSOP16,.25 ,
Pin Count 16
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Family LVC/LCX/Z HCT
Input Conditioning STANDARD LATCHED
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4
Length 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 5.8 ns
Propagation Delay (tpd) 8.5 ns 45 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 1.2 V 4.5 V
Supply Voltage-Nom (Vsup) 2.7 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm
Base Number Matches 2 1
Additional Feature ADDRESS LATCHES

Compare 74LVC138APW-T with alternatives

Compare GD74HCT137D with alternatives