74LVC14PW vs 74LVC14APW,118 feature comparison

74LVC14PW Philips Semiconductors

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74LVC14APW,118 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description TSSOP, TSSOP14,.25 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e4
Load Capacitance (CL) 25 pF 50 pF
Logic IC Type INVERTER INVERTER
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP14,.25 TSSOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Prop. Delay@Nom-Sup 7.3 ns 8 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Supply Voltage-Nom (Vsup) 3.3 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.65 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Part Package Code TSSOP
Pin Count 14
Manufacturer Package Code SOT402-1
Samacsys Manufacturer NXP
Family LVC/LCX/Z
Length 5 mm
Moisture Sensitivity Level 1
Number of Functions 6
Number of Inputs 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 10 ns
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 1.2 V
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm

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