74LVC157AD-T
vs
MC74LCX257DT
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NEXPERIA
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Package Description |
,
|
TSSOP, TSSOP16,.25
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Date Of Intro |
2017-02-01
|
|
| JESD-609 Code |
e4
|
e0
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Moisture Sensitivity Level |
1
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
3
|
5
|
| JESD-30 Code |
|
R-PDSO-G16
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.024 A
|
| Number of Functions |
|
4
|
| Number of Inputs |
|
2
|
| Number of Terminals |
|
16
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP16,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Power Supplies |
|
3.3 V
|
| Prop. Delay@Nom-Sup |
|
6 ns
|
| Qualification Status |
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.635 mm
|
| Terminal Position |
|
DUAL
|
|
|
|
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