Findchips: Compare 74LVC1G00GV,125 vs 74LVC1G00GW,115

74LVC1G00GV,125 vs 74LVC1G00GW,115 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes
Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Part Package Code	TSOP	TSSOP
Package Description	PLASTIC, SOT-753, SC-74A, 5 PIN	TSSOP,
Pin Count	5	5
Manufacturer Package Code	SOT753	SOT353-1
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G5	R-PDSO-G5
JESD-609 Code	e3	e3
Length	2.9 mm	2.05 mm
Load Capacitance (CL)	50 pF
Logic IC Type	NAND GATE	NAND GATE
Max I(ol)	0.024 A
Moisture Sensitivity Level	1
Number of Functions	1	1
Number of Inputs	2	2
Number of Terminals	5	5
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Equivalence Code	TSOP5/6,.11,37
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method	TR
Peak Reflow Temperature (Cel)	260
Prop. Delay@Nom-Sup	6 ns
Propagation Delay (tpd)	10.5 ns	10.5 ns
Qualification Status	Not Qualified
Schmitt Trigger	NO
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	Tin (Sn)	TIN
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.95 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30
Width	1.5 mm	1.25 mm
Base Number Matches	2	2
	Logic » Gates	Logic » Gates