74LVC1G00GV-Q100H vs 74LVC1G00GV-Q100 feature comparison

74LVC1G00GV-Q100H NXP Semiconductors

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74LVC1G00GV-Q100 Nexperia

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code TSOP
Package Description TSSOP, TSOP5/6,.11,37 TSSOP,
Pin Count 5
Manufacturer Package Code SOT753
Reach Compliance Code compliant compliant
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e3
Length 2.9 mm 2.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.024 A 0.032 A
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSOP
Package Equivalence Code TSOP5/6,.11,37 TSOP5,.10,37
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE
Packing Method TR
Prop. Delay@Nom-Sup 6 ns
Propagation Delay (tpd) 10.5 ns 10.5 ns
Qualification Status Not Qualified
Schmitt Trigger NO YES
Screening Level AEC-Q100 AEC-Q100
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.95 mm 0.95 mm
Terminal Position DUAL DUAL
Width 1.5 mm 1.5 mm
Base Number Matches 2 2
HTS Code 8542.39.00.01
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.004 mA
Time@Peak Reflow Temperature-Max (s) 30

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