74LVC1G00GW-Q100H
vs
74LVC1G00GV-Q100H
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
NEXPERIA
|
NEXPERIA
|
Part Package Code |
TSSOP
|
TSOP
|
Package Description |
1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5
|
TSSOP,
|
Pin Count |
5
|
5
|
Manufacturer Package Code |
SOT353-1
|
SOT753
|
Reach Compliance Code |
compliant
|
compliant
|
Samacsys Manufacturer |
Nexperia
|
Nexperia
|
Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
JESD-609 Code |
e3
|
e3
|
Length |
2.05 mm
|
2.9 mm
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Inputs |
2
|
2
|
Number of Terminals |
5
|
5
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
TR, 7 INCH
|
TR, 7 INCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
10.5 ns
|
10.5 ns
|
Screening Level |
AEC-Q100
|
AEC-Q100
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
TIN
|
TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.95 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1.25 mm
|
1.5 mm
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
4 Weeks
|
|
|
|
Compare 74LVC1G00GW-Q100H with alternatives
Compare 74LVC1G00GV-Q100H with alternatives