Findchips: Compare 74LVC1G07GW,165 vs 74LVC1G07GW,115

74LVC1G07GW,165 vs 74LVC1G07GW,115 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes
Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Part Package Code	TSSOP	TSSOP
Package Description	1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5	TSSOP,
Pin Count	5	5
Manufacturer Package Code	SOT353-1	SOT353-1
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G5	R-PDSO-G5
JESD-609 Code	e3	e3
Length	2.05 mm	2.05 mm
Logic IC Type	BUFFER	BUFFER
Max I(ol)	0.024 A
Moisture Sensitivity Level	1
Number of Functions	1	1
Number of Inputs	1	1
Number of Terminals	5	5
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Characteristics	OPEN-DRAIN	OPEN-COLLECTOR
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Equivalence Code	TSSOP5/6,.08
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method	TR
Peak Reflow Temperature (Cel)	260
Propagation Delay (tpd)	8.4 ns	8.4 ns
Qualification Status	Not Qualified
Schmitt Trigger	NO
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.65 V
Supply Voltage-Nom (Vsup)	1.8 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	Tin (Sn)	TIN
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30
Width	1.25 mm	1.25 mm
Base Number Matches	2	2
	Logic » Gates	Logic » Gates