Findchips: Compare 74LVC1G08GW/DG,125 vs TC7SZ08FU(TE85L,F)

74LVC1G08GW/DG,125 vs TC7SZ08FU(TE85L,F) feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	Yes	Yes
Rohs Code	Yes	Yes
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	TOSHIBA CORP
Part Package Code	SOT-353	SSOP
Package Description	TSSOP,	TSSOP, TSSOP5/6,.08
Pin Count	5	5
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G5	R-PDSO-G5
JESD-609 Code	e3
Length	2.05 mm	2 mm
Logic IC Type	AND GATE	AND GATE
Moisture Sensitivity Level	1	1
Number of Functions	1	1
Number of Inputs	2	2
Number of Terminals	5	5
Operating Temperature-Max	125 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)	NOT SPECIFIED	NOT SPECIFIED
Propagation Delay (tpd)	10.5 ns	10.5 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.8 V
Supply Voltage-Nom (Vsup)	1.8 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	INDUSTRIAL
Terminal Finish	Tin (Sn)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED	NOT SPECIFIED
Width	1.25 mm	1.25 mm
Base Number Matches	1	1
Load Capacitance (CL)		50 pF
Max I(ol)		0.024 A
Package Equivalence Code		TSSOP5/6,.08
Packing Method		TR
Prop. Delay@Nom-Sup		5.5 ns
Schmitt Trigger		NO
	Logic » Gates	Logic » Gates