Findchips: Compare 74LVC1G08GW-R vs TC7SZ08FU(TE85L,F)

74LVC1G08GW-R vs TC7SZ08FU(TE85L,F) feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	No	Yes
Rohs Code	Yes	Yes
Part Life Cycle Code	Active	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	TOSHIBA CORP
Package Description	TSSOP,	TSSOP, TSSOP5/6,.08
Reach Compliance Code	compliant	unknown
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G5	R-PDSO-G5
Length	2.05 mm	2 mm
Logic IC Type	AND GATE	AND GATE
Number of Functions	1	1
Number of Inputs	2	2
Number of Terminals	5	5
Operating Temperature-Max	125 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)	NOT SPECIFIED	NOT SPECIFIED
Propagation Delay (tpd)	10.5 ns	10.5 ns
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	1.65 V	1.8 V
Supply Voltage-Nom (Vsup)	3.3 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	INDUSTRIAL
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED	NOT SPECIFIED
Width	1.25 mm	1.25 mm
Base Number Matches	1	1
Part Package Code		SSOP
Pin Count		5
HTS Code		8542.39.00.01
Load Capacitance (CL)		50 pF
Max I(ol)		0.024 A
Moisture Sensitivity Level		1
Package Equivalence Code		TSSOP5/6,.08
Packing Method		TR
Prop. Delay@Nom-Sup		5.5 ns
Qualification Status		Not Qualified
Schmitt Trigger		NO
	Logic » Gates	Logic » Gates